Assessing the value of a lead-free solder control plan using cost-based FMEA

نویسندگان

  • Edwin Lillie
  • Peter Sandborn
  • David Humphrey
چکیده

While the transition to lead-free electronics, which began nearly a decade ago, is complete for most commercial products, many safety, mission and infrastructure critical systems that were originally exempt from RoHS and WEEE are only now transitioning. For these types of products qualification is very expensive and the consequences of failure can be catastrophic, therefore carefully engineered control plans are needed when technology or process changes are required. A control plan is a set of activities that a manufacturer can choose or be required to perform to ensure product performance. This paper uses cost-based FMEA to determine the projected cost of failure consequence for a technology insertion control plan for the adoption of lead-free solder for the assembly of electronic systems in critical applications that previously used tin-lead solder. A case study of the lead-free implementation of a power supply demonstrates the return on investment of the control plan for the same product under to different risk scenarios.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Computer Aided Design Solution Based on Genetic Algorithms for FMEA and Control Plan in Automotive Industry

In this paper we propose a computer-aided solution with Genetic Algorithms in order to reduce the drafting of reports: FMEA analysis and Control Plan required in the manufacture of the product launch and improved knowledge development teams for future projects. The solution allows to the design team to introduce data entry required to FMEA. The actual analysis is performed using Genetic Algorit...

متن کامل

Workability study in near-pritectic Sn-5%Sb lead-free solder alloy processed by severe plastic deformation

Prediction of the deformation characteristics is an important step to understand the workability of alloys during imposing large strains. In this research, severe plastic deformation of Sn-5Sb solder alloy was carried out under different t deformation conditions, including the temperature range of 298, 330, 36, 400 K and die designs. The current study applies an experimentally validated finite ...

متن کامل

Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...

متن کامل

Investigation of microstructure and physical properties in nanocomposite solder reinforced with various percent of graphene nanosheets (SAC0307+GNSs)

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions ...

متن کامل

Manufacturing & Reliability Data for Lead Free Flip Chip Solder Bumping based on IBM’s C4NP process

High-end microelectronic packaging is increasingly moving from wire bonds to solder bumps as the method of interconnection. There are various solder bumping technologies used in volume production. These include electroplating, solder paste printing, evaporation and the direct attach of preformed solder spheres. Flip chip in Package (FCiP) requires many small bumps on tight pitch whereas Wafer L...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Microelectronics Reliability

دوره 55  شماره 

صفحات  -

تاریخ انتشار 2015